PI tape
Polyimide (PI) is an organic polymer material containing a quinone imine group. The preparation method is mainly from the reaction of diamines and biguanides to form polyamic acid (Polyamic acid). PAA), followed by high temperature ripening and dehydration (Imidization) to form a polyimine polymer. Due to its excellent thermal stability and good mechanical, electrical and chemical properties, it has always been the first choice for high performance polymer materials, especially in the electronic IC industry where materials are critical, such as high temperature tape. , flexible circuit board, IC passivation film LCD alignment film, enameled wire and other insulation materials, of course, its output value is constantly increasing.
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Thermal tape
Thermal double-sided tape
Good thermal conductivity and strong adhesion (strength increases with time. Good adhesion to metal and plastic) Easy to apply (material tear resistance) Customized alternative to heat curing adhesive, screw fastener application can help tear pull.
TP-15 series
Applications: Various semiconductor components, central processing units, capacitors, LED lamps, motherboards, chassis, heat sinks, LCD TVs, various computers, memory modules, video and television machines, etc.
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TP-30 series
Applications: Various semiconductor components, central processing units, capacitors, LED lamps, motherboards, chassis, heat sinks, LCD TVs, various computers, memory modules, video and television machines, etc.
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